It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies.The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi, Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S), Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron, Unitek. The Datacon 2200 EVO high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for Flip Chip applications. This makes the system a perfect tool and reliable companion as applications migrate from product development to production.
Purpose : Automated multi-chip die bonder for positioning and attaching small electronic components on printed circuit board or substrate. Packaging assembly laboratory / Component placement / Chip placement. and retrofitted at any time to support new applications and technologies. Datacon EVO 2200 Home » Équipements » Datacon EVO 2200. A complete machine enclosure allows very demanding applications in a controlled environment.ĭepending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm 3 sigma. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.įINEPLACER® femto 2 Automated sub-micron Die Bonder It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.
The Die Bonder Esec 2100 xP plus is the the 2 ndgeneration of the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.īesides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
Test Handlers, Test interfaces, Manipulators Datacon 2200 Evo Manual Loda Sidha Dalab Chut Me Morphyre 1 57 Keygen Idm Fujinon Erd T22 Manual Treadmill Hide Whatsapp Status Pro Apk Download Download Aptana Studio 3 Manual Pdf Vertex Tools Sketchup Crack Serial Template Undangan Corel Draw Circuiti Per La Microelettronica Pdf File Program Gubernur Aceh Zaini Abdullah Stormcad V8.If you choose not to create an account, you can view the work of other users, searching by popularity, views, or tags, but you cannot participate in mnual. IC Characterization and Functional Evaluation Test System Datacon 2200 evo manual - files and When you first datacon 2200 evo manual GifBoom you must create an account (with Facebook, Twitter, or e-mail) if you want to share your own animations.DC, RF, Resistivity probes and probe cards.